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Precision Electronics

3D printing electronics is emerging as a viable alternative to traditional manufacturing processes. This is especially relevant as  electronics are becoming smaller, more tightly packaged, and subjected to more demanding conditions. Miniaturization, the growing number and density of electronic components, and faster data speeds that produce more heat are just some of the challenges that today’s electronic designers face.

Application Cases

Chip Test Connectors

  • 10 μm

    Optical resolution

  • 9 pcs

    Batch printing

  • 2100 +

    Microporous array

Chip Test Connectors

Each model measures 31 × 28 × 4 mm³, and up to 9 units can be printed in a single batch. Each chip test socket contains 2,100 micro-holes, with a hole diameter of 350 μm and a spacing of 50 μm between holes, making it suitable for high-volume PCB testing.

  • 10 μm

    Optical resolution

  • 9 pcs

    Batch printing

  • 2100 +

    Microporous array

  • 50 μm

    Spacing

Rectangular connector housing

  • 10 μm

    Optical resolution

  • 100 μm

    Minimum wall thickness

  • 140 μm

    Minimum spacing

Rectangular connector housing

Rapid printing of precision structures enables quick validation of small batches

  • 10 μm

    Optical resolution

  • 100 μm

    Minimum wall thickness

  • 140 μm

    Minimum spacing

Circular connector

  • 25 μm

    Optical resolution

  • 54 each

    Pin-hole structure

  • 240 μm

    Thinnest wall thickness

Circular connector

Dimensions: 11.5 × 11.5 × 12 mm³; 54-pin structure; the pins feature a concentric circular structure with varying diameters, with the smallest hole measuring 600 μm and the thinnest wall thickness being 240 μm.

  • 25 μm

    Optical resolution

  • 54 each

    Pin-hole structure

  • 240 μm

    Thinnest wall thickness

RJ connector

  • 25 μm

    Optical resolution

  • 140 μm

    Minimum wall thickness

  • 280 μm

    Minimum spacing

RJ connector

Dimensions: 16.7 × 9.55 × 9.36 mm³, minimum wall thickness: 0.14 mm,minimum spacing: 0.28 mm. The material offers both strength and toughness

  • 25 μm

    Optical resolution

  • 140 μm

    Minimum wall thickness

  • 280 μm

    Minimum spacing

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